We are developing 6” – 8” semiconductor wafer processing platform at Japan in collaboration with Japanese company’s SEW (Semiconductor Equipment Workforce) and Nippon-WST. This equipment is five-wafer processing equipment for wafer size of 6” (150 mm) or 8” (200mm). Please contact us for more details.
1. Process of Annealing and RTP, can be performed using this tool
2. Process on five wafers.
3. Susceptor to heat wafer up to 1000oC-1200oC
4. Cooling channel for susceptor body and reactor body
5. Height adjustable electrically isolated substrate holder
=> Annealing is the heat-treatment used to restore disordered semiconductor wafers to crystalline perfection, after selected 'dopant' impurities have been implanted into the wafers (as energetic ions) to adjust the electrical conductivity.
